Аннотация:Laser cleaning of organic contamination from microelectronic device surfaces has been studied. It was applied to remove plasma debris accumulated on flexible circuit for inkjet printer cartridge and mold flash on IC packages. Compared to conventional cleaning techniques, pulsed laser cleaning has advantages of being fast speed, flexible, easy control, dry and non-contact processing. An audible acoustic wave, plasma-induced electric field and plasma optical signals were used for real-time monitoring of the cleaning process. This permits to perform complete removal of the organic contamination of the device substrates without any damage.