Competitive adsorption of Cu2+ and chloride ions, polyethyleneglycol and sulfur-containing organic additives on copper insulfuric acid electrolytes

Andreeva, N.P.; Kuznetsov, I.A.; Chirkunov, A.A.; Polikarchuk, V.A.; Derkachev, M.S.; Kozaderov, O.A.; Sotskaya, N.V.; Shikhaliev, K.S.

Авторы: Andreeva N.P., Kuznetsov I.A., Chirkunov A.A., Polikarchuk V.A., Derkachev M.S., Kozaderov O.A., Sotskaya N.V., Shikhaliev Kh S.
Журнал: International Journal of Corrosion and Scale Inhibition
Том: 12
Номер: 4
Год издания: 2023
Издательство: Некоммерческое партнерство коррозионистов "Вакор"
Местоположение издательства: Москва
Первая страница: 2482
Последняя страница: 2495
Номер статьи: 54
DOI: 10.17675/2305-6894-2023-12-4-54
Аннотация: A model electrolyte (0.5 M H2SO4 + 0.1 g/L CuSO4) was proposed to study the co-adsorption of chloride ions and organic additives by the ellipsometric method. Commercial additives Avangard and APhDS (bis(2-aminophenyl)disulfide), an inhibitor PEG-115 used in copper electrodeposition, were used as brightening agents. The mixture of NaCl and PEG-115 is practically not adsorbed on the electrode. Avangard and APhDS enhance the adsorption of NaCl and PEG-115 when added sequentially. Comparing the effect of Avangard and APhDS on the adsorption of the mixture (NaCl + PEG-115), it can be noted that APhDS additives have a more stimulating effect on adsorption. The adsorption isotherm of APhDS on the surface of a copper electrode from the solution of 0.5 M H2SO4 + 0.1 g/L CuSO4 at E=0 V was obtained. The adsorption isotherm is described by the Temkin equation. The value of adsorption free energy =33.57 kJ/mol suggests chemical adsorption of APhDS on the surface
Добавил в систему: Андреева Нина Павловна

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Competitive adsorption of Cu2+ and chloride ions, polyethyleneglycol and sulfur-containing organic additives on copper insulfuric acid electrolytesстатья

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